Programming Automation via DLL
121
DWORD
layer
DWORD
DeviceEndAddrHigh;
DeviceBufStartAddrLow;
// (out) High 32 bits of device end address for this
// (out) Low 32 bits of device memory start address
in buffer for this layer
DWORD
DeviceBufStartAddrHigh;
// (out) High 32 bits of device memory start address
in buffer for this layer
UINT
BOOL
UnitSize;
FixedSize;
// (out) Size of layer unit, in bits (8, 16 or 32)
// (out) Size of layer cannot be changed with
ACI_ReallocBuffer()
CHAR
CHAR
UINT
UINT
BufferName[64];
LayerName[64];
NumBuffers;
NumLayers;
//
//
//
//
(out)
(out)
(out)
(out)
Buffer name
Layer name, cannot be changed
Total number of currently allocated buffers
Total number of layers in a buffer
} ACI_Layer_Params;
BufferNumber
LayerNumber
LayerSizeLow,
LayerSizeHigh
The ordinal number of the memory buffer , content of which is required by
the ChipProg memory buffers begin from #0.
The ordinal number of the layer in the memory buffer , the content of which
is required by the ACI_GetLayer function. The layer numbers begins from
#0.
Here the function returns the range of the memory layer's addresses in
bytes.
Here the function returns the device's start address for the selected
DeviceStartAddrLow, memory layer . This address is the device's property and strictly depends
DeviceStartAddrHigh on the device type - usually this value is zero. Do not mix it up with the
start address of a programming operation that can be shifted by a certain
offset value.
Here the function returns the device's end address for the selected memory
layer. This address is the device's property and strictly depends on the
DeviceEndAddrLow,
DeviceEndAddrHigh
device type. Do not mix it up with the end address of a programming
operation editable in the setup dialog. The selected layer's address range
can be defined as a difference between the end address and the start
address plus 1.
DeviceBufStartAddrL Here the function returns the start address for the selected - usually this
ow,
DeviceBufStartAddrH
igh
UnitSize
FixedSize
LayerName
value is zero.
This structure member specifies formats of the data in memory layer : 8 for
the 8-bit devices, 16 - for 16-bit devices and 32 for 32-bit devices.
This flag, if TRUE, disables resizing the memory layer by the
ACI_ReallocBuffer function. There is one restriction on use of this flag:
since the layer #0 is always resizeable the FixedSize is always FALSE
for the layer #0.
The name of the memory buffer as it was defined in the ChipProg interface
or by the ACI_CreateBuffer
Reserved name of the memory buffer's layer that cannot be changed by the
ACI.DLL user.
? 2010 Phyton, Inc. Microsystems and Development Tools
相关PDF资料
CHUSBWB-2 BATT CHARGER AA/AAA W/2AAA CELLS
CK-S6-SP623-G BOARD DEV S6 WITH TX
CK-V6-ML628-G KIT VIRTEX-6 CHAR ML628
CLSD004 LED DRIVER PROGRAMMER W/CABLE
CMC484812 RACK STEEL 12X48X48 GRY
CMCQP3 PANEL INNER 25.59X15" GREY
CML12C32SLK KIT STUDENT LEARNING 16BIT HCS12
CMR-8040 RACK CABLE MANAGMNT OPEN ASSMBLY
相关代理商/技术参数
CHIPPROG-G41 功能描述:PROGRAMMER GANG 4 SOCKET RoHS:是 类别:编程器,开发系统 >> 独立编程器 系列:- 产品目录绘图:CHIPPROG-G4 标准包装:1 系列:- 类型:成组编程器 适用于相关产品:EEPROM,EPROM,FLASH,MCU,NVRAM,PLD 所含物品:编程器,线缆,CD 产品目录页面:598 (CN2011-ZH PDF) 相关产品:AE-TS56-16I-3-ND - ISP CABLEADAPTER 14-PIN HEADERAE-TS40N-ND - ADAPTER SOCKET 40-TSOP TO 40-DIPAE-TS32N-ND - ADAPTER SOCKET 32-TSOP TO 32-DIPAE-TS28-ND - ADAPTER SOCKET 28-TSOP TO 28-DIPAE-T44-P16-ND - ADAPTER SOCKET 44-QFP TO 40-DIPAE-T44-I51/505-ND - ADAPTER SOCKET 44-QFP TO 40-DIPAE-SS56-16I-ND - ADAPTER SOCKET 56-SSOP TO 40-DIPAE-SP8U-ND - ADAPTER SOCKET 8-SSOP TO 8-DIPAE-SP28U2-ND - ADAPTER SOCKET 28-SSOP TO 28-DIPAE-SP28U1-ND - ADAPTER SOCKET 28-SSOP TO 28-DIP更多...
CHIPPROG-ISP 功能描述:PROGRAMMER IN-SYSTEM UNIVERSAL RoHS:是 类别:编程器,开发系统 >> 内电路编程器、仿真器以及调试器 系列:- 产品变化通告:Development Systems Discontinuation 19/Jul/2010 标准包装:1 系列:* 类型:* 适用于相关产品:* 所含物品:*
CHIPS CAPACITOR 0.015UF 50V CERAMIC 制造商:AVX Corporation 功能描述:CHIPS CAPACITOR 0.015UF50VCERAMIC*NIC*
CHIPS-IN-DIPS 制造商:未知厂家 制造商全称:未知厂家 功能描述:ASIC
CHIPT1593CSE6327X1SA1 制造商:Infineon Technologies AG 功能描述:RF SILICON MMIC - Gel-pak, waffle pack, wafer, diced wafer on film
CHIPV6 制造商:JDSU 制造商全称:JDS Uniphase Corporation 功能描述:The industrya??s most compact 100 G test solution
CHIS-24 制造商:Mencom 功能描述: